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Developed by PROMATION’s Robotics Division, the new PANDA-460 Laser Marking Cell represents a major leap forward in traceability and process automation. Designed to accommodate any of the KEYENCE laser heads (CO₂, YV04, or UV), the system offers unmatched flexibility for a wide range of substrates and applications — all within a standard work envelope powered by Windows 11 and PROMATION-developed I/O and motion-control cards.

“There are plenty of good laser markers out there — but very few great ones,” said Michael Thomas Goldberg, Vice President of PROMATION USA and head of the company’s Robotics Division. “The PANDA-460 was engineered to close that gap. It’s not only about marking precision; it’s about creating a smarter, more connected experience for manufacturers who demand reliability, remote visibility, and real-time control.”

Smarter, Faster, More Connected

Leveraging PROMATION’s proprietary software architecture, engineers can remotely access and control every aspect of the machine — from programming adjustments and data-transmission speeds to diagnostic review and corrective actions — ensuring maximum uptime and minimal maintenance.

The PANDA system also integrates a high-performance vision-alignment platform, orientation validation, code verification, and double-sided PCB marking, making it one of the most feature-rich solutions on the market. The thoughtful design emphasizes operator experience, delivering an intuitive interface without sacrificing technological sophistication.

“Every detail of the PANDA Laser Marking System was built with the customer in mind,” added Gary Goldberg, President and CEO of PROMATION USA. “It combines the precision and repeatability that engineers expect with the usability and reliability that production teams require — all backed by PROMATION’s reputation for world-class support.”

Engineered for the Future of Smart Manufacturing

The PANDA-460 isn’t just a standalone solution — it’s fully compatible with PROMATION’s growing family of Smart Factory-ready systems, including robotic soldering, PCB handling, AMRs, and inline process-integration equipment. Together, these technologies form a connected automation ecosystem that allows manufacturers to achieve higher throughput, greater traceability, and long-term process optimization.

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This innovative solution provides critical infrastructure operators with the missing link the industry has been waiting for in terms of complementary Positioning, Navigation and Timing (PNT). The TP4500 provides a resilient, terrestrial solution in the absence of Global Navigation Satellite Systems (GNSS) for precise timing, alleviating physical obstruction, security and signal interference costs associated with GNSS-dependent deployments.

Most current deployments require GNSS at grandmaster sites, but the TP4500 enables highly resilient synchronization without relying on GNSS. The TP4500 supports time reference provided by UTC(k) UTC time provided by national labs, and is the first grandmaster to offer a premium capability that delivers High Accuracy Time Transfer (HA-TT) as defined by ITU-T G.8271.1/Y.1366.1 (01/2024) to meet 5 nanoseconds (ns) time delay over 800 km (equating to 500 picoseconds (ps) average per node, assuming 10 nodes), setting a new industry benchmark for accuracy.

The TP4500 system can be configured with multiple operation modes to form an end-to-end architecture known as virtual PRTC (vPRTC), capable of delivering PRTC accuracy over a long-distance optical network. vPRTC is a carrier-grade architecture for terrestrial distribution of HA-TT, which has been widely deployed in operator networks throughout the world.  HA-TT is a proven and cost-effective approach, as opposed to other alternative PNT solutions that have no wide adoption into critical infrastructure networks to date, have low Technology Readiness Levels (TRL) and are still dependent on GNSS as the ultimate source of time.

“The TimeProvider 4500 v3 grandmaster is a breakthrough solution that empowers operators to deploy a terrestrial, standards-based timing network with unprecedented accuracy and resilience,” said Randy Brudzinski, corporate vice president of Microchip’s frequency and time systems business unit at Microchip. “This innovation reflects Microchip’s commitment to delivering the most advanced and reliable timing solutions for the world’s most essential services.”

TimeProvider 4500 v3 is a key steppingstone towards support of the ITU-T G.8272.2 standard, which defines a coherent network reference time clock (cnPRTC) in amendment 2 (2024). An cnPRTC architecture ensures highly accurate, resilient, and robust timekeeping throughout a telecom network. This allows stable, network-wide ePRTC time accuracy, even during periods of regional or network-wide GNSS unavailability or other failures and interruptions.

 Key features of the TimeProvider 4500 v3 series:

• Sub-nanosecond accuracy: Delivers 5 ns time delay over long distances up to 800 km Terrestrial alternative to GNSS: Enables critical infrastructure to operate with resilient synchronization mechanisms independent of GNSS
• Seamless integration: Standards-based terrestrial network for time transfer, easily integrated with off-the-shelf small form-factor pluggable and existing Ethernet and optical deployments
• Exclusive capability: Premium software features available only on the TP4500 v3, integrating Microchip’s PolarFire^® FPGA and Azurite synthesizer for unmatched precision

Optimized for telecom, utilities, transportation, government, and defense, the TP4500 grandmaster ensures precise and resilient timing where it matters most. This latest version provides operators with a scalable solution for secure and reliable time distribution over long distances.

The TP4500 is the newest product to join Microchip’s portfolio of IEEE^®-1588 Precision Time Protocol (PTP) grandmaster clocks, which provide industry-leading performance and value. These field-proven solutions scale from low-density indoor applications to high-capacity 5G network timing requirements. For more information about the company’s portfolio of grandmaster clocks, visit the web page.

Pricing and Availability

The TimeProvider 4500 v3 grandmaster is available for purchase in production quantities. For additional information and to purchase, contact a Microchip sales representative or an authorized distributor.

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KIC, the leader in smart thermal process technologies for electronics manufacturing, will exhibit its latest innovations at productronica 2025, taking place November 18–21 at Messe München in Munich, Germany. Visitors to Hall A4, Booth 214 are invited to discover how KIC continues to push the boundaries of process insight and control for today’s modern, connected factories.

KIC will feature its newest advancements in intelligent thermal management and real-time monitoring, including the Heat Map, Vapor Phase Shield, and Vibration Measurement technologies—each designed to deliver deeper visibility and precision across electronics manufacturing environments.

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Europe has already moved beyond inbox-driven quotes, with companies harnessing AI-powered instant PCB and component pricing to answer RFQs faster and more accurately. North American EMS and PCB manufacturers now face a choice: adopt the model or risk being outpaced by competitors.

In this webinar, Sam Mason, Business & Operations Lead – North America, and Florian Herborn, PCB Account & Partnerships Lead, will show how EMS teams and PCB manufacturers can standardize PCB specifications using AI and digital twins, add instant pricing for parts and projects, and tap into an ecosystem where speed and accuracy compound into market advantage. Built for North America, this system allows teams to leave spreadsheets behind and respond to RFQs before competitors can.

Attendees will see how to turn Gerber files and BOMs into real-time PCB and component prices, streamlining quoting and matching the speed European teams have already achieved. They’ll also learn how to standardize costing across plants and teams, power customer-facing instant-pricing portals, and align with EMS partners on panels, lead times, and cost drivers. The session includes a live demonstration of Luminovo’s newly released PCBAI module, providing a firsthand look at what AI can do for PCB pricing.

“Luminovo brings AI, automation, and standardization to the PCB supply chain,” said Sam Mason, Business & Operations Lead – North America, Luminovo. “We can provide instant PCB pricing, which allows for fast and competitive quotes, and is the golden standard for winning more business.”

This webinar is ideal for EMS procurement leaders, sourcing and quoting teams, PCB shop owners, sales managers, and anyone focused on improving quoting speed and accuracy.

Register now to join the live demonstration, learn from Europe’s proven approach, and give your team the North American edge: Luminovo Webinar Page.

For more information, visit www.luminovo.com.

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Seika Sangyo GmbH will showcase modern SMT technologies and testing solutions designed to enhance quality, precision, and efficiency in electronics manufacturing. Featured equipment includes HIOKI test systems such as flying probe testers and the FA1220 system for precise electronic component testing, the Sayaka PCB Router 23S for stress-free depaneling, and EMC noise scanners from Morita Tech—including the WM7400, WM9500, and WMZERO models.

“Seika Machinery and Seika Sangyo GmbH share many of the same customers and complementary product lines,” said Ogihara. “Supporting their team at productronica gives us an excellent opportunity to meet with our mutual clients and discuss how our combined expertise can better serve their manufacturing needs.”

Both Seika companies are part of the global Seika Group and collaborate closely to deliver innovative SMT solutions across key markets. Visitors are invited to meet with Michelle Ogihara at Booth A1.430 during productronica 2025 to learn more about Seika’s expanding equipment portfolio and global support network.

For more information or to schedule an appointment at productronica 2025, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com.

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PEMTRON’s lineup at NEPCON Asia reflects its focus on precision inspection and process efficiency for high-reliability manufacturing across AI, automotive, and semiconductor sectors.

The SATURN 3D Inline SPI System delivers detailed 2D color imaging combined with accurate 3D measurement using Moiré technology. Designed for high-speed lines, it captures realistic solder paste images with quad projection and resolutions of 10/15 or 18μm, using a 4MP or optional 10MP camera. SATURN helps manufacturers maintain consistent solder volume and height control across even the most demanding production runs.

The ATHENA 3D AOI System integrates AI-driven inspection functions, including automatic judgment, auto-teaching, and OCR. Its 12-way projection system minimizes shadow interference and enables highly accurate 3D measurements. ATHENA supports both 2D and 3D simultaneous inspection with resolutions down to 10μm and offers an optional 12MP camera and three-stage conveyor to maximize throughput.

Also featured will be the EAGLE 3D 8800 Compact, a high-speed AOI system built for next-generation packaging and semiconductor applications. It offers precise inspection of coplanarity, leads, and solder joints for advanced components such as chiplets and CSPs, delivering stable results at production-level speeds.

Visitors can explore these systems in action at Booth 11E80, where PEMTRON and AMT representatives will be available for live demonstrations and technical discussions.

For more information about PEMTRON, please visit www.pemtron.com.

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Graphene was initially celebrated as a sci-fi material destined to transform electronics, quantum devices, and futuristic sensors. While expectations soared, commercial reality proved more modest. Rather than enabling transparent phones or levitating trains, graphene first succeeded in practical roles such as enhancing polymer composites in tires, coatings, and sporting goods through improved strength and conductivity. Now, with advances in manufacturing and renewed interest from major electronics and energy companies, the question resurfaces: are we finally approaching the breakthrough era once promised?

IDTechEx has covered the graphene market since 2012, providing a unique perspective on technological progress, commercialization strategies, and the long-term market outlook for the material. A new report has been released, “Graphene & 2D Materials 2026-2036: Technologies, Markets, Players“, which includes granular 10-year graphene market forecasts, based on profiles of 90+ key players and leverages extensive in-depth coverage of many end-use markets for graphene.

Graphene is increasingly used in consumer electronics for thermal management, leveraging its exceptional heat conductivity to improve device cooling and reliability. Beyond passive materials, its high surface area and conductivity also make it a strong candidate for energy storage applications, particularly in next-generation batteries and supercapacitors, where faster charging and longer lifetimes are sought.

Material Requirements

Pristine graphene produced via chemical vapor deposition (CVD) offers exceptional electronic performance but is costly and complex to scale. As a result, it’s primarily reserved for high-end sensing applications. Most other uses such as thermal management films or battery additives can rely on lower-grade, bulk graphene materials without requiring perfect atomic structure.

IDTechEx believes that thermal management applications is a key early area for graphene adoption. There is increasing demand for high-performance heat spreaders, and the graphene properties and morphology are well-suited. The thermal conductivity of carbon materials tend to be higher than that seen in metals, with graphene oxide (GO) reporting a thermal conductivity in excess of 3,000 W/m·K. For anisotropic materials such as graphene, achieving through-plane alignment is key for a thermally efficient system, capable of minimising material usage and enabling cost savings. Multiple routes exist based on the material to be aligned, including mechanical methods and dielectrophoresis. This need for alignment to enhance thermal conductivity is mirrored in applications leveraging the electrical conductivity of graphene, such as when using graphene dispersions as conductive inks.

Overview of the growing importance of graphene in electronic applications over the coming decade. Source: IDTechEx market report “Graphene & 2D Materials 2026-2036: Technologies, Markets, Players”.

China Leads the Way for Consumer Electronics

For some years the centre of gravity for graphene has been shifting towards China. This trend has shown up in several indicators including investment levels, patent filing trends, academic publication and in the number and size (at least nominal size) of graphene companies. Key players include The Sixth Element, Leadernano and SCF Nanotech.

The use of graphene for thermal management has increasingly been observed across the leading Chinese smartphone manufacturers as higher performances are demanded. This varies from acting as very localised heat spreader, a larger heat spreader or replacing a vapor chamber. A cooling system, such as vapor chamber (VC) technology, manages a phone’s heat by using evaporation and condensation to dissipate warmth from internal components. This prevents overheating, enhances performance, and extends battery life. Huawei has taken this concept further with the Mate X6 by incorporating graphene sheets. Other leading smartphone players including Realme, ZTE, Xiaomi and OnePlus have reported use of graphene in various heat spreading technologies.

Other consumer electronics to have adopted graphene heat spreaders include gaming-grade laptops and monitors with Acer, ViewSonic and Samsung Display active in this area. Beyond heat spreaders, adoption of graphene has also been seen in headphones with players reporting that coating audio drivers with graphene can reduce vibrations and allow powerful bass with enhanced mid- and high-range frequencies. Household names have released graphene-enhanced headsets, including Logitech, and LG, with graphene typically featuring in high-end headsets. Philips bucked this trend when the mid-range H8000E was launched in January 2025, featuring graphene-coated 40 mm drivers.

Will Graphene Achieve Success in Energy Storage?

The term “graphene battery” is widely misused. In reality, graphene is more likely to be one of several conductive additives selected based on cost, morphology, and performance, potentially used at the electrode, current collector, or pack level. Today, it is rarely found in commercial lithium-ion cells, with limited success mainly in high C-rate consumer devices. In contrast, carbon nanotubes are already established in current cathode formulations with well-established supply chains for lithium-ion batteries.

Looking ahead, graphene’s best opportunity within energy storage lies in enabling next-generation technologies such as silicon anodes, which are expected to scale commercially. However, it is only one contender in an intensely competitive, well-funded landscape where many alternatives also offer effective conductive networks. If graphene is the enabling technology that unlocks silicon anodes, then strong and significant growth will be seen for this material.

For more details on the graphene market, including granular 10-year forecasts for 18 different application areas, see the IDTechEx market report “Graphene & 2D Materials 2026-2036: Technologies, Markets, Players“. For more information on IDTechEx’s other reports and market intelligence offerings, please visit www.IDTechEx.com/Research.

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