50 years of productronica – world’s leading trade fair celebrates anniversary

When productronica takes place in Munich from November 18 to 21, 2025, a milestone birthday will be on the agenda. The world’s leading trade fair for the development and production of electronics is celebrating its 50th anniversary. Originally launched as an exhibition area of electronica, over the course of half a century productronica has developed into the leading international meeting place for electronics manufacturing. The conceptual sponsor of productronica is the industry association VDMA Productronic.

Messe München CEO Dr. Reinhard Pfeiffer offers his congratulations on the event’s anniversary: “For 50 years now, productronica has been showcasing innovations along the entire value chain of electronics manufacturing. It therefore plays an indispensable role by setting the pace for the entire industry. Together with electronica, it also strengthens Munich’s position as a leading international electronics location.”

Key players have confirmed their participation

More than 1,400 companies from the fields of PCB & EMS, SMT, semiconductors, inspection & quality, future production & smart factory, and cables, coils & hybrids will present their solutions and products at productronica. Among others, key players such as ASMPT, Ersa, Fuji, Komax, Rohde & Schwarz and Viscom have already confirmed their participation in the event.

Key topics of productronica 2025

This year’s productronica will focus on three key topics. Advanced packaging, power electronics and securing the value chain through secure microelectronics.

Advanced packaging – key role in microelectronics

Compared to traditional chip encapsulation, Advanced Packaging uses innovative approaches such as 2.5D and 3D integration, chiplet technologies and wafer-level packaging to maximize the performance of modern electronic systems. These technologies are crucial for applications in high-performance computers, AI accelerators, 5G and IoT devices as well as in automotive and medical technology. Thanks to shorter signal paths, improved heat dissipation and higher bandwidths, advanced packaging not only increases the efficiency of semiconductor systems, but also helps to reduce production costs and material consumption. It therefore plays a key role in the further development of microelectronics and enables innovations in an increasingly networked world.

Innovative application examples for Advanced Packaging will be shown at the VDMA Special Exhibit area: Research institutes such as Silicon Austria Labs, or PhoenixD will be showing the latest developments, such as micro-optical systems on glass substrates for tap-proof telecommunications. Schweizer Electronic will be presenting its embedding technology as a solution for applications in power electronics, also highlighting the production techniques.

In addition to the semiconductor manufacturers themselves, research and development also plays a key role in the field of Advanced Packaging. For example, the Fraunhofer Institute for Reliability and Microintegration IZM has developed the Future Packaging production line, which will be part of productronica 2025. Exhibitors such as Asys, F&K Delvotec and Fuji will be taking part in the special show. The Future Packaging production line aims to examine how a higher degree of digitalization and automation can make production processes more robust against disruptions and external influences.

Power electronics – a guarantee for sustainability and resource conservation

Power electronics are essential for applications in e-mobility, renewable energies, industrial automation and power semiconductors for high-frequency and high-voltage applications. By using modern semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN), it is possible to reduce power losses and component sizes while improving operational reliability. Power electronics therefore makes a significant contribution to a sustainable and resource-saving energy supply and to the further development of innovative technologies in various industries.

Automotive, C3.501 Infineon, Halbleiter, Nachhaltigkeit, Stromversorgung

At productronica 2025, exhibitors from the semiconductor ecosystem will show how they are solving these challenges with a good instinct for the right technologies and an innovative spirit. F&S Bondtec, for example, will show how the company is using the right connection technology to manufacture high-quality machines for chiplet production that meet miniaturization requirements. Panasonic also always offers the right connection with its convincing SiC packaging solutions. Leading high-volume packaging technologies for SiC and GaN will be presented by ASMPT, for example, and Yamaha Robotics will showcase suitable robots for packaging semiconductor components.

In addition, the VDMA—conceptual sponsor of productronica—ill offer visitors to its “Special Exhibit” stand B2 in Hall 461 an insight into various collaborations for research and development in the field of power electronics. Schweizer Elektronik, for example, will demonstrate how a Si-MOSFET improves the power unit of an inverter for a starter generator. Silicon Austria Labs will show, among other things, how an energy converter control panel for wind turbines can work much more efficiently with modern power components. Elektra Solar will also present an electrically powered aircraft at productronica.

Secure microelectronics protect digital infrastructures

Secure microelectronics refers to the development and production of safe, dependable and tamper-proof semiconductor technologies along a transparent and controlled value chain. The aim is to ensure the integrity, authenticity and cybersecurity of microelectronic components – especially in safety-critical applications. This technology is of central importance for the likes of the automotive, industrial automation, medical technology and defense sectors, where the availability and protection of sensitive data and resistance to attacks are essential. By using security-certified manufacturing processes, traceable supply chains and hardware-based security mechanisms, secure microelectronics make a significant contribution to protecting digital infrastructures and technological sovereignty.

SEMICON Europa will also be held in parallel with productronica in 2025. This will occupy Halls B1, C1 and C2.

productronica.com

Exhibition guide from the first Productronica in 1975